Please use this identifier to cite or link to this item: http://dspace.dtu.ac.in:8080/jspui/handle/repository/15281
Title: CFD ANALYSIS OF WAVY MICRO-CHANNEL HEAT SINK WITH HEMISPHERICAL OBSTRUCTION
Authors: KUMAR, RAJNISH
Keywords: CFD ANALYSIS
FLUID FLOW
WAVY MICRO-CHANNEL
HEMISPHERICAL OBSTRUCTION
HEAT SINK
ANSYS CFX
Issue Date: Oct-2016
Series/Report no.: TD NO.2567;
Abstract: In the present study of fluid flow, there are three cases. In first case, pressure drop and heat transfer characteristics of rectangular micro-channel heat sinks have been analysed and validation is done by comparing experimental results with numerical results using computational fluid dynamics. Water is taken as coolant and cooper is used as a sink material. In the second case, geometry of the channel has been changed, by making it wavy edge with hemispherical obstructions and the simulation results are obtained by taking all the parameters same as that of the first case. The main aim of changing the geometry of the straight channel to wavy channel with the inclusion of hemispherical obstructions is to increase the surface area and contact time of coolant with the heated surface to increase the temperature rise by decreasing thermal resistance. In the third case, Performance Fluid PF 5052 is taken as a coolant instead of water and cooper is taken as a sink material and rest of the parameters are same as that of second case and finally simulation results are obtained. At last comparative study of results all the three cases are done. Both the micro-channels have a width of 0.23mm and height of 0.71 mm. The aspect ratio (ɣ) and the length of both the channels is kept same as 0.32 and 44.7mm respectively. The diameter of hemispherical obstruction is taken as 0.22 mm. The analysis for both the micro-channels is done for five sets of Reynolds number which are 400, 600, 800, 1000 and 1200 respectively. The two values of heat flux used are 100W/cm2and 200W/cm2.After constructing the geometry in solid works and partially in the Design Modular, the simulation is done on ANSYS CFX.
URI: http://dspace.dtu.ac.in:8080/jspui/handle/repository/15281
Appears in Collections:M.E./M.Tech. Thermal Engineering

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