SYNTHESIS AND STUDIES OF POLYURETHANE BASED CONDUCTING ADHESIVES WITH ZINC AND NICKEL NANO-PARTICLES AS FILLERS

Abstract

The present work has been carried out with an objective to synthesize a PU based electrically conductive adhesive (ECA) using metallic fillers such as Zinc and Nickel. For the better dispersion of fillers in polymeric matrix, the filler used in the present studies were of nano-range. The solder that has dominated the present day electronic industry has many inherent demerits and drawbacks. It is associated with health hazards and bad environmental impacts due to presence of lead in it. To overcome these health hazards, the researchers have been exploring the field of ECAs to find a suitable replacement. The future of present day electronics industry depends upon the research and development work done in the field of conducting adhesive. Commonly used ECA is epoxy and filler based conducing adhesive. But the strength of epoxy substrate is less. Hence, we have tried to enhance the conductivity of polyurethane based adhesive. We have used metallic filler to enhance the conductivity of the PU based adhesives to develop ECA. Along with conductivity it is desirable to have good mechanical strength of the sample should be good. Thus, conductivity along with good mechanical strength of ECA that can have potential for the replacement of solder technology in future. In the present studies, we have used with zinc and nickel nano-particle as fillers with the polyurethane adhesive. The comparison of conductivity and mechanical strength of the adhesives using different fillers was done. It was observed that the conductivity of PU was enhanced with addition of metallic filler.