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dc.contributor.authorJOSHI, MILIND-
dc.date.accessioned2011-12-01T11:51:47Z-
dc.date.available2011-12-01T11:51:47Z-
dc.date.issued2011-12-01-
dc.identifier.urihttp://dspace.dtu.ac.in:8080/jspui/handle/repository/13825-
dc.descriptionM.TECHen_US
dc.description.abstractAs per the academic requirement of my M.E project, I got the opportunity to work with STMicroelectronics, Greater Noida for my 1 year Internship course. I have worked on a project (Nomadik) of Chip designing & Verification of advanced futuristic Symbian60 based Nokia mobiles in STEricsson (ST-NXP/WMM department). Previously in my minor project, I have been involved in establishing unconventional SOC virtual platform for Nokia mobiles having Arm's CortexA9 processor (A real time multi processor multi threaded system based on ARM’s platform). SOC virtual platform is systemC based transaction level models used for rapid chip designing by early embedded software development & for market capturing. After deploying all intellectual properties (IPs) for SOC virtual platform, a research project plan Early Integration Platform Using SOC Simulation was proposed for the complete validation purposes including concurrent software development at all levels, including firmware, device drivers, OS porting, middle-wares and OS-application by using functional software model of each component of SOC hardware and software. I worked on following main parts which are developed for the completion of this platform which includes: 1) Command Interpreter at SVP side (It manages data transfer between SVP dummy driver and Communication application) 2) Winsock Communication Application at Client PC (To tunnel API/data between Ethernet port and USB) 3) Command Interpreter at Board side (It manages data transfer between Board’s USB driver and actual drivers)en_US
dc.language.isoenen_US
dc.relation.ispartofseriesTD 769;-
dc.subjectSOC SIMULATIONen_US
dc.subjectEARLY INTEGRATION PLATFORMen_US
dc.titleEARLY INTEGRATION PLATFORM USING SOC SIMULATIONen_US
dc.typeThesisen_US
Appears in Collections:M.E./M.Tech. Electronics & Communication Engineering

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Milind major project report.doc1.76 MBMicrosoft WordView/Open


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